适用于复合材料、半导体材料、石材、玻璃、陶瓷等进行抛光、打磨，可以根据客户的需要，进行各种规格尺寸的生产，具有加工效率高、精度高、磨损小的特点。 Mainly used for polishing and ginding composite materials,semiconductor materials,stone,glass and ceramic.Different specifications and sizes can be made according to customers'requirements，with the characterics of high processing efficiency,high precision,less wear.