适用于切割复合材料、半导体材料、石材、石墨、陶瓷、水晶、玉石、玻璃等硬质材料，可以根据客户要求加工定做各种规格，具有加工效率高、精度高、磨损小的特点。 Widely used of cutting composite materials,semiconductor materials,stone,graphite,ceramic,crystal,jade,glass and other hard materials.Different specifi.With the characterics of high processing efficiency,high precision,less wear.